In our MEMS fab, we design and produce our own intrinsic MEMS vertical probe. It is used for testing high-end LSI semiconductors such as Application Processor because many probes can be arrayed in small area with high precision.
We can satisfy customers’ all needs from high-end product with more than 30,000pins on 100 100㎛ pitch to Ultra fine pitch product with less than 50㎛ pitch.
|Application||AP / CPU / GPU / Smart IC|
|Probe type||MEMS (WILL MEMS TM)||Wire / Cobra|
|Min. grid pitch||50㎛||60㎛||80㎛||100㎛||150㎛||100㎛|
|Probe tip type||Flat (Solder bump, Cu pillar bump) & Pointed (Al pad, Cu pad)|
|Max. pin count||34,000 ea|
|Max. parallelism||16para (512 para for Smart IC)|
|Max. test speed||2.4Gbps|