Epoxy Cantilever Type
Cantilever probe is produced by precisely processing metal wire, and it is attached on the PCB with epoxy. This type of probe card is widely used for testing various kinds of semiconductors.
Our technique to array probes in small pitch (1/10 of a strand of hair) is best in the world, and we are capable of applying our design to test all kinds of semiconductors.
1st in the world to develop and produce 11㎛ fine pitch product
Application | DDIC (Display driver IC) |
SoC (System on chip) |
CIS (CMOS Image sensor) |
Smart IC |
Min. prob pitch | 11㎛ | 25/50㎛ | 70㎛ | 70㎛ |
Max. parallelism | 8para | 8para | 32para | 512para |
Max. test speed | 4Gbps | 800Mbps | – | |
Temp. range | -25~125˚C | -40~150°C | ~100˚C |