PCB test jig/fixture

Jig可支援測試搭載半導體Chip的Substrate PCB和Film PCB的良率。

PCB Test Jig 和Fixture採用了Wafer Test的Vertical Probe card技術進行設計與製造, 並擁有可應用於多種Packaging PCB測試的細分化產品技術。


2018年韓國首位開發Wire Vertical Probe 4Wire電性檢測 Jig 技術
2019年世界首位開發應用MEMS Vertical Probe技術之90㎛pitch 4Wire 電性檢測 Jig 技術
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Application Substrate PCB Film PCB for DDIC COF Package
Probe type MEMS Probe type Wire Probe type Wire Probe type
Probe tip type Flat,
Point and Customize
RR : C-BUMP
FR : R-BUMP
NR : ETS (Embedded Trace Substrate)
NF : P-Pad
RR : Sn Pad Test
Min. probe pitch 90㎛,
2wire,
Full 4wire test
130㎛,
Varies by product specification
2wire, 4wire test
82㎛,
Only O/S test (using the sensor block)
Max. parallelism 4pcs 1-256pcs 1-4pcs
Jig structure Top / Bottom Pin block test Top / Bottom Pin block test Top : Sensor test
Bottom : Pin block test