Vision & Mission
VISION |
Seek for new items for the future and develop new technical solutions |
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MISSION |
World best Convergence Probing Solution R&D Center |
MEMS JIG
New product
Technology
MEMS
Epoxy Cantilever
Fusion
Core Technology
– Probe Design for MEMS VPC
– Standardization of Probe Evaluation Technology
– Probe card technology to endure severe test conditions
Design & Simulation
• Software
| Program | Mechanical | Thermal | Electrical |
| Program | • ANSYS Mechanical ANSYS NL • Auto CAD • Solidworks |
• Solidworks Flowsim ANSYS Mechanical | • ANSYS HFSS • Cadence Powersi |
| Capability | • Stress • Reliability • Plastic deformation • Solder damage • Pad deformation |
• Thermal resistance • Conduction • C.C.C • Stress distribution by thermal • Thermal flow |
• S-parameter extraction (Insertion/Return loss) • TDR/TDT Analysis (Eye-diagram) • Timing (Delay/Skew) |
• Hardware
| Program | Mechanical | Thermal | Electrical |
| Measuring equipment | • C.C.C Analyzer • Force & C-Res. Analyzer |
• Probe tester | • Network Analyzer • Current source meter |
Design & Analysis of Probe Card Circuit
– PCB, MLC Design and Simulation
– Auto Check Tool (HP93K, Uflex, T2K, MAGNUM)
– High Speed Measurement & Verification Lab.
Design & Optimization of Mechanical Parts
– Probe Card Deformation upon Probing Force
– Bump Damage by Probe Force
– New Probe Design
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