Vision & Mission
VISION |
开发高成长潜质产品及解决方案 |
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MISSION |
全球领先之复合式 Probing Solution R &Ｄ 研究中心 |
MEMS JIG
新产品技术
MEMS
Epoxy Cantilever
复合式技术
核心技术
– MEMS VPC Probe Design
– Probe 评价技术标准化
– 严酷测试环境下 Probe card 稳定性
Design & Simulation
• Software
| Program | Mechanical | Thermal | Electrical |
| Program | • ANSYS Mechanical ANSYS NL • Auto CAD • Solidworks |
• Solidworks Flowsim ANSYS Mechanical | • ANSYS HFSS • Cadence Powersi |
| Capability | • Stress • Reliability • Plastic deformation • Solder damage • Pad deformation |
• Thermal resistance • Conduction • C.C.C • Stress distribution by thermal • Thermal flow |
• S-parameter extraction (Insertion/Return loss) • TDR/TDT Analysis (Eye-diagram) • Timing (Delay/Skew) |
• Hardware
| Program | Mechanical | Thermal | Electrical |
| Measuring equipment | • C.C.C Analyzer • Force & C-Res. Analyzer |
• Probe tester | • Network Analyzer • Current source meter |
Design & Analysis of Probe Card Circuit
– PCB, MLC Design and Simulation
– Auto Check Tool (HP93K, Uflex, T2K, MAGNUM)
– High Speed Measurement & Verification Lab.
Design & Optimization of Mechanical Parts
– Probe Card Deformation upon Probing Force
– Bump Damage by Probe Force
– New Probe Design