Vision & Mission
VISION |
開發高成長潛質產品及解決方案 |
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MISSION |
全球領先之複合式 Probing Solution R&D 研究中心 |
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核心技術
– MEMS VPC用 Probe Design
– Probe 評價技術標準化
– 嚴酷測試環境下 Probe card 穩定性
Design & Simulation
• Software
| Program | Mechanical | Thermal | Electrical |
| Program | • ANSYS Mechanical ANSYS NL • Auto CAD • Solidworks |
• Solidworks Flowsim ANSYS Mechanical | • ANSYS HFSS • Cadence Powersi |
| Capability | • Stress • Reliability • Plastic deformation • Solder damage • Pad deformation |
• Thermal resistance • Conduction • C.C.C • Stress distribution by thermal • Thermal flow |
• S-parameter extraction (Insertion/Return loss) • TDR/TDT Analysis (Eye-diagram) • Timing (Delay/Skew) |
• Hardware
| Program | Mechanical | Thermal | Electrical |
| Measuring equipment | • C.C.C Analyzer • Force & C-Res. Analyzer |
• Probe tester | • Network Analyzer • Current source meter |
Design & Analysis of Probe Card Circuit
– PCB, MLC Design and Simulation
– Auto Check Tool (HP93K, Uflex, T2K, MAGNUM)
– High Speed Measurement & Verification Lab.
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Design & Optimization of Mechanical Parts
– Probe Card Deformation upon Probing Force
– Bump Damage by Probe Force
– New Probe Design