Vertical Type
In our MEMS fab, we design and produce our own intrinsic MEMS vertical probe. It is used for testing high-end LSI semiconductors such as Application Processor because many probes can be arrayed in small area with high precision.
We can satisfy customers’ all needs from high-end product with more than 30,000pins on 100 100㎛ pitch to Ultra fine pitch product with less than 50㎛ pitch.
1st in Korea and 3rd in the world to produce 80㎛ pitch MEMS vertical probe in production level
Provided probe cards for Samsung “Exynos” and Qualcomm “Snap Dragon” AP chips.
Provided probe cards for Samsung “Exynos” and Qualcomm “Snap Dragon” AP chips.
| Application | AP / CPU / GPU / Smart IC | |||||
| Probe type | MEMS (WILL MEMS TM) | Wire / Cobra | ||||
| WM50 | WM60 | WM80 | WM100 | WM130 | ||
| Min. grid pitch | 50㎛ | 60㎛ | 80㎛ | 100㎛ | 150㎛ | 100㎛ |
| Probe tip type | Flat (Solder bump, Cu pillar bump) & Pointed (Al pad, Cu pad) | |||||
| Max. pin count | 34,000 ea | |||||
| Max. parallelism | 16para (512 para for Smart IC) | |||||
| Max. test speed | 2.4Gbps | |||||
| Temp. range | -40~150°C | |||||