R&D
What We Do ?
● Structure Study of Probe Card and It’s Components
– Structural Deformation Analysis upon Environmental Variables.
– Probe Card Reliability Study under Extreme Conditions.
– Robust Probe Card Structure Design.
– Customer-Specific Structure Design & Simulation Supports.
● Probe Card Circuit Design, Analysis & Optimization
– In-House Probe Card Circuit Design : MLC, MLO, Main PCB, Other Circuit Boards.
– Power & Signal Integrity Design.
– Characterization of Probe Card Circuit.
– Customer-Specific Circuit Design & Simulation Supports.
– Research on Advanced Space Transformers.
PCB & MLC for CIS MEMS Probe Card
PCB & MLO for AP MEMS Vertical Probe Card
Signal Integrity Simulation & Analysis
Power Integrity Simulation & Analysis
● Research on Core Technologies For Next-Generation Semiconductor Testing
– Research on Unique High-Performance Probe & Probe Head Design.
– Contact Characteristics According to Probe and Semiconductor Electrode Materials.
– Characterization of Various Probes.
– Research on New Materials & Process for Probe & Probe Card.