Quality Assurance
| Items | PRVX3 | Probe WoRx | PRVX4 |
| Capability(Pin) | 800,000/M | 1,000,000/M | 400,000/M |
| Equipment | Vertical : 200,000/M CIS MEMS : 200,000/M Cantilever : 400,000/M |
Vertical : 800,000/M CIS MEMS : 200,000/M |
Vertical : 400,000/M |
| Mother Board | Ultra Flex 300mm_2 Tools | Ultra Flex 300mm_1 Tool Ultra Flex 440mm_2 Tools |
Ultra Flex 300mm_1 Tool |
| Capability(Pin) Outgoing Inspection |
Vertical : 1,000,000/M CIS MEMS : 300,000/M Cantilever : 400,000/M |
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3.2 Micro Craft – E4H6151
| Maximum board head | Repeat precision | Minimum pad pitch | Minimum pad size | Cramping |
| 9mm | ±4 | 50㎛ | 15㎛ | Automatic clamp |
NST-9000V
| Use | E-Check Jig inspection | What you use | Open/Short/Leakage Scan |
Measuring Microscope
| Use | P/C Needle and Depth,Tip Diameter,Tip Length,Probe Depth,Clearance,Beam Length,Planarity measurement |
Laser Cleaning M/C
| Use | Removal of cross-sectional debris and oil film, increase of contact Resistor effect, decrease o/s fail, prevent departmental phenomena and corrosion, can be applied on manufactured goods and PCB |