DDIC COF Package Test Probe Card

Korea’s first COF(Chip on Film) package test probe card commercialization for ND4 test facilities.
Development of 3-parallel probe card using MEMS vertical probe technology.

DDIC semiconductors are manufactured as ‘Chip on Film’ (COF) packages to be mounted on the latest mobile and flexible display products.
Probe card for COF packages are mainly manufactured using epoxy cantilever probe technology, and have the world’s best technology to meet customer needs such as high speed characteristics and increased number of simultaneous inspection chips.

Types of Product

Cantilever Type

MEMS Vertical Type