History of Willtechnology

jQuery Timeline 0.9.54 – Dando vida al tiempo
  • 2001

    02 Established a Corporation (Doksan-Dong, Seoul)

    Park Dae-jung take office as a first CEO


    03 Registered at Korea International Trade Association

    Enrolled at Korea International Trade Association


    08 Manufacturing LDI 45㎛ Pitch Probe Card


    12 Development of Logic Type Probe Card

  • 2002

    02 Moved the factory and headquarters to larger facility (Hogye-Dong, Anyang-Si, Gyunggi-Do)


    06 Korea’s first development of LDI 35㎛ Pitch Probe Card

    Enrolled as Partner with Samsung Electronics Co.


    10 Obtain Certification of ISO9001

    Opened Customer Service center at Giheung site (Hwasung-Si, Gyunggi-Do)

  • 2003

    09 Korea’s first development of LDI 25㎛ Pitch Probe Card


    11 Developing a new materials needle

    Selected as Professional Company specialized in Parts and Materials (Ministry of Commerce Industry and Energy)

  • 2004

    04 Enrolled as Partner with SK Hynix

    Selected as Venture Company Developing new Technology


    05 Established a R & D Center


    06 Selected as Outstanding Technology Company (By Korea Technology Trust Finance Corporation)


    08 Selected as Promising Small & Medium Company (Kookmin Bank)

    Established a Customer Service Center in Taiwan (Artech Technology Corp)

    Moved the factory and headquarters to larger facility (Geumjung-Dong, Gunpo-Si, Gyunggi-Do)

    Obtain certification of Technology Innovative Small & Medium Company (Inno-Biz Company)

  • 2005

    02 Development of WPT Needle

    (Applied to Mass Production of Samsung Semiconductor and Oversea’s Companies)


    06 Korea’s first development of LDI 20㎛ Pitch Probe Card

    Established a branch office in Taiwan (TWN Will Technology Co., Ltd.)


    09 Moved the factory and headquarters to larger facility of Giheung Repair Shop


    11 Established an ERP System with the assistance of Samsung Electronics Co.

  • 2006

    02 Korea’s first development of LDI 19㎛ Pitch Probe Card


    03 Established a FPC Division


    04 Registered a Patent of Non-Contact Inspection Device

  • 2007

    01 Opened Customer Service center at Ochang


    02 Moved the factory and headquarters to larger facility (Imok-Dong, Jangan-Gu, Suwon-Si)

    Kim YongGyun take office as a CEO

    Korea’s first development of LDI 17㎛ pitch Probe Card


    05 Opened Customer Service center at Chunan


    10 Signed Technology Export Contract with AAT Inc, in Japan


    11 Established a Employee Stock Ownership Association

  • 2008

    01 Received Investment Attraction from Sky Lake Co., Ltd.


    10 Selected as a Leading Technology Innovation Development Business


    11 Expanded R & D Center

  • 2009

    04 Selected as 2009 Patent Star Company (By Gyunggi Techno Park)


    05 Selected as Kibo A+ Members (By Korea Technology Finance Corporation)

    Certified as Venture Company (By Korea Technology Finance Corporation)


    10 Established a Manufacturing Execution Systems (MES)


    11 Opened Customer Service center at Changwon

  • 2010

    01 Selected as Outstanding Work Place in Gyunggi-Do (Gyunggi Provincial Office)


    06 Supported for Company Affiliated Laboratory Upgrade


    07 Successfully Developed a Mems Probe Card and Mass Production

  • 2011

    08 Selected as Excellent Enterprise of Shared Growth (Dong-A Daily News)

    Awarded Small and Medium Businessman Award (CEO)


    09 President Lee Myung-bak visited

  • 2012

    03 Selected as Honest Taxpayer in 2012 (Gyunggi Provincial Office)

    Awarded ‘2012 Growing Together Day’ Quality Renovation Prize from Samsung electronics

    Enrolled as a Membership of the Samsung Electronics Partnership Association (Council)


    04 Awarded Open-minded Employer Leader Award (CEO)


    05 Awarded Knowledge Economy Minister Award (CEO)


    07 Selected as Outstanding Work Place Company in Gyeonggi province


    12 Received President’s Commendation for Silver Tower Industrial Service Merit

  • 2013

    03 Received Technology Innovation Award from Samsung Electronics Co., Ltd


    06 Achieved Double for Zero Hazard Campaign

  • 2014

    11 Lee YoonJung take office as a CEO

  • 2015

    04 Established Customer Service Center at Global Foundries Inc. (U.S.A)

    Developed new products with Qualcomm Technologies, Inc. (U.S.A)


    07 Developed new products with Advanced Micro Devices, Inc. (Singapore)

    Signed Joint Growth Agreement with IWIN (Korea)


    08 Obtain new products Development from Sony Electronics Inc.

    Enrolled as Partner with Sony Electronics Inc. (Japan)


    12 Received qulification of Cobra Vertical products for Cu-pillar from Qualcomm Technologies, Inc (U.S.A)

  • 2016

    02 Signed NDA with OmniVision Technologies Inc. (U.S.A)

    Developed MEMS Vertical for Cu Pillar probing Technology with Qualcomm Technologies, Inc (U.S.A)


    05 Developed Vertical MEMS products for KYEC, Taiwan (End User: MediaTek)


    06 Received Qulification of 80um pitch MEMS Vertical products for Cu Pillar probing from Samsung Electronics Co., Ltd (Korea)

    Developed Vertical MEMS products for KYEC


    07 (World’s Third and Korea’s first) Received qulification of Vertical MEMS developed products from Qualcomm Technologies, Inc (U.S.A)


    08 (World’s Third and Korea’s first) Received qulification of Vertical MEMS mass products from Qualcomm Technologies, Inc (U.S.A)


    10 Selected as IBK Technology Hidden Champion

  • 2017

    01 Received the Ministry of Trade, Industry and Energy’s Commendation for the ‘Nano Fusion Technology Manpower Training Industry’

  • 2018

    02 Awarded 2017 Samsung Electronics Award for Best Partner

  • 2019

    07 Certified of a company specializing in material and parts company


    12 Selected as Top 100 Materials, Parts and Equipment Hidden Champion

    Awarded ‘Promotion of Venture Start-up’ from Director of Small and Medium Venture Business

    Selected as ‘Gyeonggi Province’s Promising Small and Medium Enterprises’

  • 2020

    12 Family-Friendly Good Company to Work ,Gyeonggi

    World’s first development success of MEMS Fixure Jig for substrate PCB NSOP type electrical inspection

  • 2021

    01 Selected as Youth-Friendly Enterprise


    02 2020 Samsung Electronics Excellent Partner


    03 Awarded 2021 Samsung Electronics Excellent Innovation Partner


    05 Selected as Innovative Enterprise National Representative 1000


    07 Selected as 2021 Gyeonggi-do Sincere Taxpayer (Gyeonggi-do Provincial Office)

  • 2022

    01 Selected as Youth-Friendly Enterprise

    Additional joint development of MEMS Fixure Jig for Samsung Electro-Mechanics’ substrate electrical inspection and signed an exclusive supply / purchase contract


    06 Obtain certification of ISO45001 (Occupational Health and Safety Management System)


    07 Selected as Core Strategic Technologies for Materials, Parts, and Equipment (Ministry of Trade, Industry and Energy)

    Received confirmation of a company specializing in materials, parts and equipment (Korea Institute of Industrial Technology Evaluation and Management)


    10 Selected as 2022 Suwon Special City Sincere Taxpayer (Suwon Special City Hall)


    12 Awarded a Million Dollar Export Tower

    2022 Received the Ministry of Trade, Industry and Energy’s Commendation for ‘Nano Convergence Technology Manpower Training Industry’

    2022 Received the Minister of SMEs and Startups Commendation for ‘Enhancing Small and Medium Enterprises with Materials, Parts, and Equipment’

  • 2023

    02 Multi Para Extension Development for ND4 Successful


    03 03 Selected as Gyeonggi-do Sincere Taxpayer (Gyeonggi-do)

    Successful Development and Localization of AP Probe Card for Cu Pad (End User: MediaTek)

    Intel 14th Generation CPU core mass production verification completed


    07 Conclusion of quality control agreement for Chip Bond, Taiwan


    10 Successfully developed Rh Point Probe for 3D IC Al Pad


    12 ODM Contract Enacted for R, China

  • 2024

    02 2023 Samsung Electronics Awarded Outstanding Partner for Contribution to Cost Reduction

    NDA Contract for S, Japan


    05 Selection of Leading Companies in Materials, Components, and Equipment