MEMS Cantilever Probe Card
World’s first MEMS probe card development for inspecting CMOS image sensors for DSLR.
World’s first MEMS probe card development for inspection of CMOS image sensors for automobiles.
World’s first 64-Parallel MEMS probe card development for CMOS image sensor inspection.
World’s first FWC(Full Wafer Contact) type MEMS Probe Card development for CMOS Image Sensor inspection .
It uses a three-dimensional MEMS cantilever probe array implemented through precision MEMS process technology, and has low signal noise and excellent electrical characteristics, so it is applied to inspection of CMOS image sensor and DRAM semiconductors.
By maximizing the number of simultaneous inspection chips, wafer test efficiency of customers can be greatly improved, especially leading the high-end MEMS probe card market for CMOS image sensor inspection.
CMOS Image Sensor (Diffuser Type)
CMOS Image Sensor (Lens Type)
CMOS Image Sensor for DSLR
Automotive CMOS Image Sensor