Epoxy Cantilever Probe Card
World’s first development of 11㎛ ultra fine pitch product technology and commercialization.
The world’s best probe card manufacturing technology (Exporting technology to Japan).
Mass production of all tester standard probe cards for multi-variety system semiconductor testing.
This product is manufactured by fixing cantilever probes, made of fine metal wire with epoxy on a PCB and is widely applied to testing various semiconductors.
Our fine pitch manufacturing technology, which is 1/10th the thickness of human hair, is recognized as the world’s best technology, and has abundant application design capabilities across all semiconductor fields.
Application
Display Driver IC (DDIC)
System on Chip (SoC)
CMOS Image Sensor (CIS)
SMART IC