Vision & Mission
VISION |
미래 성장 동력 ITEM 발굴 및 SOLUTION 개발 |
||
MISSION |
Global Best 융·복합 Probing Solution 연구 센터 |
핵심 요소 기술
– MEMS VPC용 Probe Design
– 전사 Probe 평가 기술 표준화
– 극한 환경 Probe card 신뢰성 기술
• Software
| Program | Mechanical | Thermal | Electrical |
| Program | • ANSYS Mechanical ANSYS NL • Auto CAD • Solidworks |
• Solidworks Flowsim ANSYS Mechanical | • ANSYS HFSS • Cadence Powersi |
| Capability | • Stress • Reliability • Plastic deformation • Solder damage • Pad deformation |
• Thermal resistance • Conduction • C.C.C • Stress distribution by thermal • Thermal flow |
• S-parameter extraction (Insertion/Return loss) • TDR/TDT Analysis (Eye-diagram) • Timing (Delay/Skew) |
• Hardware
| Program | Mechanical | Thermal | Electrical |
| Measuring equipment | • C.C.C Analyzer • Force & C-Res. Analyzer |
• Probe tester | • Network Analyzer • Current source meter |
Design & Analysis of Probe Card Circuit
– PCB, MLC Design and Simulation
– Auto Check Tool (HP93K, Uflex, T2K, MAGNUM)
– High Speed Measurement & Verification Lab.
[smartslider3 slider=72]
[smartslider3 slider=71]
Design & Optimization of Mechanical Parts
– Probe Card Deformation upon Probing Force
– Bump Damage by Probe Force
– New Probe Design